Mid-tier Multi-Purpose Soldering Grid for iPhone 16 Series (YCS)

Mid-layer General-purpose Tin Planting Platform for iPhone 16 Series (YCS)

Compatibility Check: iPhone 16 Pro, iPhone 16 Pro Max

• Precise reballing of multi-layer logic boards
• Restores damaged or missing solder joints on internal layers
• Ensures accuracy in aligning mid-layer solder pads
• Ideal for repairing CPU, PMIC, and complex IC modules
• High-temperature resistant mesh for professional micro-soldering work

Scope of Delivery: One Mid-layer General-purpose Tin Planting Platform

Installation Note: Install according to the instructions for the respective assembly.