Low-Temperature Solder Paste 150℃ (50g) (YCS)

Low Temperature Solder Paste 150℃ (50g) – Ideal for Sensitive Component Sets

• Specifically designed 150°C melting point for gentle reflow, micro-bonding, and repair processes
• Optimal application for heat-sensitive integrated circuits and flexible circuit boards
• Prevents overheating of sensitive components during assembly and installation
• Purity and consistency for reliable solder joints on fine-pitch components
• Practical 50-gram packaging suitable for daily repair work and production lines

Technical specifications: Melting point 150°C, Weight 50g, Container size 50g.

Scope of delivery: 50g solder paste in easy-to-handle packaging.

Note: Follow instructions for safe application and use appropriate protective measures.