High-Temperature Solder Paste 215℃ (50g) (YCS)

High Temperature Solder Paste 215℃ (50g) – 215℃ Melting Point

Compatibility Check: Suitable for multilayer logic boards, IC installation, pad rebuilding, and high-temperature operation.

• 215℃ melting point for demanding reflow and rework applications
• Strong, durable solder joints that withstand high operating temperatures
• Smooth application process for precise placement on fine-pitch or micro-components
• Reference size 50g for professional repair labs and high-volume workflows
• Formulated for stability, consistency, and reliable performance under heat

Scope of delivery: 50g solder paste in a dehumidifying carton.

Please clean and dry the solder joint thoroughly before application to ensure an even connection.