Bumblebee Stencil (QS163) for EMMC/EMCP/UFS – Qianli

Bumblebee Stencil (QS163) for EMMC/EMCP/UFS – Square Holes, Rounded Edges, Precise BGA Placement

Compatibility Check: Specifically for EMMC, EMCP, and UFS chips.

• Square holes with rounded edges for precise BGA placement.
• Design optimized for EMMC, EMCP, and UFS solder ball reballing.
• New coating and materials ensure even greater precision and ease of use.
• Robust, durable material guarantees longevity.
• Easy handling and accurate pitch control for consistent results.

Scope of delivery: 1 piece Bumblebee Stencil (QS163) for EMMC/EMCP/UFS.

Installation note: Follow recommended safety guidelines and instructions to ensure correct, compliant installation.