Solder Paste Sn63/Pb37 35g Syringe No-Clean (NC-559-V2) (Amtech)

Soldering Paste Sn63/Pb37 35g Syringe No-Clean (NC-559-V2)

• Sn63/Pb37 (lead-based) paste for optimal solder yield
• Finely treatable particle size of 25–45 µm
• 87% metal content for high quality solder joints
• No-Clean flux prevents creation of cleaning waste
• Convenient 35 g syringe for precise dispensing

Technical data: Melting temperature 183 °C; Particle size 25–45 µm; Metal content 87%; Flux No-Clean; Net weight 35 g.

Scope of delivery: 1 x 35 g syringe with soldering paste.

Installation note: Carefully dispense the paste onto the individual components and bond the component at 183 °C. For best results, it is recommended to use a precision paste dispenser.