Qianli 007 Side Glue Remover

Side Glue Cleaner (007) – Precise Adhesive Remover for BGA Repair

• Three curved crescent blades for targeted adhesive removal around IC chips.
• Thickness 0.1 – 0.3 mm for precise handling on logic boards.
• Available in stainless steel or aluminum alloy for durability.
• Reinforced handle made of non-slip material ensures a secure grip.
• Use in electronic BGA repairs for smartphones and other devices.

Technical Specifications:

• Thickness: 0.1 – 0.3 mm
• Material: Stainless Steel & Aluminum Alloy
• Color: Gold & Gray

Scope of Delivery:

• 1 x Non-slip stainless steel handle
• 3 x Curved crescent blades made of stainless steel/aluminum alloy
• Shipping packaging (minimal)

Installation Note: Use the Side Glue Cleaner with the device's power supply secured and with appropriate protective measures to ensure professional adhesive removal.