Promax All-Purpose Mid-Layer Solder Stencil for iPhone X / 11 Series (YCS)

Promax Mid-layer General-purpose Tin Planting Platform – Tin Mesh for Precise Reballing

Compatibility Check: Compatible with iPhone X and iPhone 11 series (incl. 11 Pro, 11 Pro Max, XS Max)

• Tin mesh for precise reballing of logic board solder pads on iPhone 11 Pro, 11 Pro Max, and XS Max
• Restoration of damaged or missing pad structures during IC replacement and multi-layer board testing
• Exact alignment and even solder distribution over reassembled sections
• Ideal for CPU, PMIC, and mid-layer module reballing on the mentioned iPhone models
• High-temperature resistant mesh suitable for professional micro-soldering procedures

Scope of delivery: Single mid-layer planting platform

Please observe the enclosed instructions for proper installation and implement all necessary safety measures.