Medium Temperature Solder Paste 183℃ (50g) (YCS)

Medium Temperature Solder Paste 183 °C (50 g) – Perfect Melting Temperature for Precise Reflow

• Exact melting temperature of 183 °C for precise reflow and microwelding
• Ideal for IC rearrangement, pad repair, component installation, and multilayer work
• Smooth application and reliable solder joints
• Low-residue formula, suitable for mobile logic boards and fine-pitch components
• 50 g container provides ample material for professional repair stations

Please observe the recommended temperature and application steps to ensure optimal connections.