Mid-level Universal Reballing Platform for iPhone 17 Series (YCS)

Mid-layer General-purpose Tin Planting Platform for iPhone 17 Series (YCS) – Precise Reballing

Compatibility Check:

• iPhone 17
• iPhone 17 Pro
• iPhone 17 Pro Max

• Mid-layer solder mesh for precise reballing on iPhone 17 multi-layer boards
• Accuracy in restoring mid-layer solder joints during board repair
• Improved alignment and consistency when rebuilding damaged or missing solder pads
• Ideal for CPU, PMIC, and multi-layer IC repair on iPhone 17 logic boards
• High-temperature resistant mesh, compatible with professional micro-soldering workflows

When assembling, please ensure that the power supply is disconnected and all necessary safety precautions are taken before use.