Low-Temperature Solder Paste 138℃ (50g) (YCS)

Low Temperature Solder Paste 138℃ (50g) – Low Melting Point

• 138℃ low melting point solder paste suitable for low-temperature reflow work.
• Ideal for repairing delicate components, flex cables, and multi-layer logic boards.
• Reduces the risk of thermal damage during IC installation, pad repair, and microsoldering.
• Applies smoothly for precise placement on fine-pitch and small electronic components.
• 50g container suitable for professional repair benches and frequent use.

The scope of delivery includes 50g liquid solder paste in a sealed container.

Note: Follow the instructions on the packaging for skilled application of the solder paste.