High-Temperature Solder Paste 199℃ (50g) (YCS)

High Temperature Solder Paste 199℃ (50g)

• High melting point of 199℃ for demanding reflow and rework applications.
• Suitable for multi-layer logic board repair, IC installation, and pad restoration.
• Strong, reliable solder joints that withstand high operating temperatures.
• Perfect consistency for processing fine-pitch components and micro-components.
• 50g pouch provides sufficient material for regular work in professional laboratories.

Scope of delivery:

• 1 x High Temperature Solder Paste 199℃ (50g) – original packaging.

Please note that the application of this material is best performed by experienced professionals.