Bach 2.0 IC Edge Adhesive Removal Blade

Bach 2.0 - IC Edge Glue Removal Blade: Precise Debonding of Adhesive Strips

Compatibility Check:

• IC Chips

• Enables cleaning around IC chips for optimal heat dissipation.
• Optimized design reduces friction loss during operation.
• Easy to use with a heat gun for heating the adhesive.
• Precisely cuts between the chip and the strip along the edge direction.
• Robust construction for long-term usability in professional applications.

Scope of delivery: Bach 2.0 - IC Edge Glue Removal Blade, no further accessories.

Installation Note: Install the blade by following the manufacturer's instructions and observing the necessary safety measures.