U-IP11 0.12MM A16/A17 Universal CPU Rework BGA Reballing Stencil for iPhone 15 Series (Amaoe) V3.0

U-IP11 0.12MM A16/A17 Universal CPU Rework Repair BGA Reballing Stencil for iPhone 15 Series

Compatibility Check: Suitable for iPhone 15, 15 Plus, 15 Pro, and 15 Pro Max.

• 0.12 mm tolerance for precise payback process
• Universal design suitable for A16/A17 processors
• Robust Teflon plastic material for high durability
• Optimal size 120 × 120 mm for efficient reballing
• Includes practical case for secure transport

Technical data:

• Diameter 0.12 mm
• Dimensions 120 mm × 120 mm
• Material: Teflon plastic

Scope of delivery:

• Stencil set in case

Installation note: Before use, ensure that all tools and protective devices are present. Work on a clean and well-ventilated surface and follow the usual handling rules for BGA packages.