Solder Paste 183 °C Melting Point (XG-Z40) Mechanic

Solder Tin Paste 183° Melting Point (XG-Z40) – High-Viscosity No-Clean Flux

Compatibility Check: Suitable for printed circuit boards (PCBs), SMD components, as well as for rework and soldering chips in computer and mobile phone kits.

• High viscosity for precise application on leads and small components
• No-Clean design – no bleaching residue, easy cleaning
• Mixture of high-quality alloy powder and resin-based paste flux
• Ideal for soldering and re-balling CPU and GPU chips
• Open-field application for optimal thermal conductivity

Installation Note: Apply the paste evenly to the areas to be soldered and heat the solder joint under control to ensure that the melting point of 183 °C is reached. Observe safety regulations when handling soldering irons and semiconductors.