Solder Paste SP-X for Middle Board BGA Reballing (ReLife)
€22,99
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Solder Paste SP-X for Middle Board BGA Reballing (ReLife)
€22,99
Solder Paste Middle Board BGA Reballing SP‑X By G‑LON – Lead‑Free, 158 °C Paste
- High-density paste material for optimal conductivity
- High impedance for precise signals
- Pure, lead-free alloy
- Fine and sticky for even application
- Low melting temperature – 158 °C
Technical data: Melting point 158 °C, Lead-free
Installation instructions: After thoroughly cleaning the component and the BGA pad, apply paste evenly and melt the workpiece according to the usual reballing process.