SLD01 Strong Magnetic Chip Positioning Tin Plate (YCS)

SLD01 Strong Magnetic Chip Positioning Tin Plate (YCS)

Compatibility Check: Suitable for numerous standard reballing and device repair setups, especially BGA ICs and small pad circuits.

• Strong magnetic base secures IC chips, stencils, and small components during reballing and tinning.
• Targeted chip positioning improves precision and consistency in micro-soldering work.
• Ideal for BGA ICs as well as other compact component types in phones, tablets, and motherboards.
• Flat work surface ensures even distribution of solder paste and tin on the chip pads.
• Reusable and durable – ideal for daily use in professional repair labs.

Scope of Delivery: A single magnetic chip positioning tin plate.

Installation Note: Carefully place the plate on the desired component surface, check the condition of the magnetic base after use, and clean the surface if necessary to ensure optimal adhesion.