Promax All-purpose Middle-Layer Reballing Platform for iPhone 13 Pro Max (YCS)

Promax Mid-layer General-purpose Tin Planting Platform for iPhone 13 Series

Compatibility Check: Suitable for reballing and soldering work on the logic board of iPhone 13 Pro Max models.

• Precise tin mesh for accurately controlled reballing of the logic board.
• Restoration of damaged or missing pad structures during multi-layer and IC-level repair.
• Secure, even alignment and distribution of solder paste during processing.
• Selected for CPU, PMIC, and mid-layer components on iPhone 13 Pro Max.
• High-temperature resistant mesh for professional micro-soldering work.

Scope of delivery: Shipping bag with the Promax Mid-layer General-purpose Tin Planting Platform.

Installation Note: This tool should only be used by experienced professionals as part of proper deinstallation.