Skip to product information
M.Y Board Transfer Reballing Stencil (A19) & Mid-Layer Reballing Platform for iPhone 17 Series
€23,99
M.Y Board Transfer Reballing Stencil (A19) & Middle Layer Frame Reballing Platform – iPhone 17 Series
Compatibility Check: Compatible with iPhone 17, iPhone 17 Pro, iPhone 17 Pro Max, iPhone Air, and iPhone 17e.
- Precise transfer stencil for exact pin placement
- Robustly built, ideal for repeated soldering
- Integrated Middle Layer Platform for clear handling
- Compatible with all iPhone 17 Series
- Easy to clean and handle
Scope of delivery: Transfer Reballing Stencil and Middle Layer Frame Reballing Platform.
Installation Note: Use the device according to the instructions; if unsure, consult a professional.