M.Y Board Transfer Reballing Stencil (A18 / A18 pro) and Mid-Layer Reballing Platform for iPhone 16 Series

M.Y Board Transfer Reballing Stencil (A18 / A18 Pro) & Middle Layer Frame Reballing Platform for iPhone 16 Series – Precise Application

Compatibility Check: iPhone 16 Pro Max, iPhone 16 Pro, iPhone 16 Plus, iPhone 16.

• Precise reballing stencil for secure component application
• Compatible with A18 and A18 Pro processors of the iPhone 16 Series
• Integrated middle-layer frame facilitates PCB placement
• High-quality metal construction for long service life
• Separate, easy-to-clean components for optimal maintenance

Scope of delivery: Reballing stencil, middle layer frame, and reballing platform for iPhone 16 Series.

Installation note: Follow the enclosed assembly instructions carefully to ensure optimal functionality.