M.Y Board Transfer Reballing Stencil (A15) & Mid-Layer Frame Reballing Platform for iPhone 13 Series

M.Y Board Transfer Reballing Stencil (A15) + Middle Layer Frame Reballing Platform for iPhone 13 Series

Compatibility Check: Suitable for iPhone 13, iPhone 13 Pro, and iPhone 13 Pro Max.

• Precise transfer pattern specifically for the A15 chip circuitry
• Robust reballing deck with optimal adhesion for middle layers
• Easy handling that supports inexperienced technicians
• Improves restoration practice through higher precision in soldering
• Overall optimized for the specific design of the iPhone 13 series

Scope of delivery: Transfer Reballing Stencil (A15) + Middle Layer Frame Reballing Platform.

Installation Note: Follow the enclosed instructions for proper positioning and handling. If unsure, please consult a qualified technician.