M.Y Mainboard Transfer Reballing Stencil (A13) and Middle Layer Frame Reballing Platform for iPhone 11/11 Pro/11 Pro Max (M.Y)

M.Y Board Transfer Reballing Stencil (A13) & Middle Layer Frame Reballing Platform For iPhone 11/11 Pro/11 Pro Max – Precision Stencil for A13 Boards

Compatibility Check: Compatible with iPhone 11, iPhone 11 Pro, and iPhone 11 Pro Max.

• High precision thanks to an exactly matching stencil silhouette.
• Specifically designed for the A13 chip layout.
• Facilitates the reballing and transfer project on a single platform.
• Easy to clean and reusable.
• Simplifies the work of technicians and hobbyists alike.

Scope of delivery: One Board Transfer Reballing Stencil (A13) and one Middle Layer Frame Reballing Platform.

Installation Note: Performing the reballing process requires a certain degree of expertise and suitable tools. Please follow standardized repair procedures or consult a professional if you are unsure.