Lead-free Low-Temperature BGA Solder Paste 38g (Sn42/Bi58) Melting Point 138°C - PolarTronix

Lead-Free Low Melt 38g BGA Solder Paste (Sn42/Bi58) – 138 °C Melting Point

Compatibility check: iPad, iPhone, PS5, PS4, Xbox.

• High viscosity – ideal for BGA and SMD work.
• No-Clean formula – no residue after soldering.
• Reduced melting point – facilitates repairs on old solder joints.
• Extended shelf life – 6 months after opening.
• Easy to use – 38g in a practical syringe.

Technical data: Melting point 138 °C, composition Sn42/Bi58.

Scope of delivery: 1 x 38 g BGA Solder Paste Syringe.

Installations should be carried out with appropriate expertise and equipment.