YCS DB02 Spudger Blade Set for CPU, NAND, and IC Glue Removal

DB02 Spudger Blade Set – Precise Adhesive Removal for Mobile Phones

• Robust, durable blades for precise work.
• Non-slip grip for secure handling.
• 9-in-1 design: 3×9G handles + 6×interchangeable blades.
• Lightweight, ergonomic design reduces fatigue.
• Metal case for safe transport.

Technical Data:

• Model: DB02
• Product Size: 140 × 8 mm
• Packaging Size: 60 × 175 × 20 mm

Scope of Delivery:

• 1×Metal Case
• 3×9G Handles
• 6×Interchangeable Blades

Note: Careful handling prevents damage to sensitive components.