YCS 2S Chip Heating Plate for Glue Removal
€29,99
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YCS 2S Chip Heating Plate for Glue Removal
€29,99
Chip Heating Platform For Glue Removing 2S (YCS)
Compatibility Check: Compatible with mobile phones and iPhones for IC glass glue removal.
- Safe heating for IC glass glue removal and chip detachment
- Precise temperature control for targeted glue softening
- Compact and portable, suitable for mobile workshops
- User-friendly operation for more efficient repair processes
- Supports BGA chip preheating for improved reballing and desoldering results
Installation Note: First set the desired temperature, place the chip on the platform, and perform the heating under careful observation to achieve optimal results without damaging the components.