Bumblebee Stencil (QS10) Qualcomm CPU4 (Qianli) MSM8937 7225A 8612 8916 8909 8917

Bumblebee Stencil (QS10) Qualcomm CPU4 – Precise Filling of BGA Traces

Compatibility Check:

• Qualcomm MSM8937
• Qualcomm 7225A
• Qualcomm 8612
• Qualcomm 8916
• Qualcomm 8909
• Qualcomm 8917

• Careful squares for precise BGA pads
• Round angles for a clean nozzle profile
• Programmed flat filling for even flow
• Essential durability for repeated use
• Optimized surface treatment for easy cleaning

Technical Data:

• Material: High-quality steel
• Size: 10 cm × 10 cm
• Recess Depth: 1 mm

Scope of Delivery:

• 1 × Bumblebee Stencil (QS10) Qualcomm CPU4

Installation Note: Wear appropriate protective measures and use the stencil carefully for precise BGA filling processes.