BGA Solder Balls 25,000 Pcs (0.4 mm)

BGA Lead Solder Balls 25,000 Pieces 0.4 mm – Ideal Binding Agent for BGA Boards

Compatibility Check: Suitable for iPhone X, 8 Plus, 8, 7 Plus, 7, 6s, 6s Plus, 6 Plus, 6, 5S, 5C, 5, and iPhone SE.

• Economical tin-coated wires with a fixed size of 0.4 mm.
• Contents: 25,000 pieces in one bottle – practical for large rework orders.
• High repeatability thanks to uniformly dispersed ball sizes.
• Can be easily used in automated reflow processes.
• Perfect quality for BGA boards with small drill holes.

Technical specifications: Size 0.4 mm, Quantity 25,000, Material Tin.

Scope of delivery: 1 bottle with 25,000 BGA Lead Solder Balls.

Installation note: Purchased for producing precise BGA connections – the balls can be easily integrated into existing soldering equipment.