Bach 1.0 - Underfill Removal Blade (2 mm)

Bach 1.0 - Underfill Removal Blade, 2 mm blade cut

Compatibility check: The blade is suitable for removing underfill material around IC chips on circuit boards to facilitate microsoldering.

• Ensures precise cutting around small IC chips
• 2 mm width fits various IC sizes
• Easy to use - re-gripping functions with a heat gun
• Easy to clean and reuse
• Extends the life of the cutoff edges during the completion process

Technical data: Blade base 2 mm width, hardened steel, suitable for precise underfill material placement.

Scope of delivery: 1 replaceable underfill material removal blade.

Installation note: Please note that the blade should only be used after the heat gun has cooled down - protect your hands and tools.